TBK 2206 Laser Desoldering Machine with HD Microscope for Phone Repair

• A new laser desoldering solution offers precise desoldering, intelligent control, and adjustable temperature. Precise localized heating sets new industry standards
• Laser localised heating ensures temperature stability during the desoldering process, with areas outside the heating zone remaining unaffected
• A versatile four-in-one laser head with adjustable thermal imaging, high-definition microscopy, heating range, and even lighting
• Adjustable heating range from 100 to 450°C, offering a wide temperature adjustment range to accommodate a variety of materials and desoldering processes
• After the motherboard under test is powered on, thermal imaging can quickly locate the fault point. Repairs are now more convenient, faster, and safer
• Heating solder without heat radiation, heating solder, fast heating speed, no effect on the non-heating area