TBK New-style 2202 3D Thermal Imaging Motherboard Fault Diagnosis Instrument with Mobile Phone Holder

• TBK 2202 3D thermal imaging fault diagnosis instrument, quickly and accurately detects fault points on the motherboard circuit through infrared thermal imaging technology
• Fault detection knows at a glance quickly locates faulty components
• It can be connected to mobile phones. tablets and computers, three connections are easy to use (support Android system, Windows system)
• Using a high-resolution thermal imager, it can clearly display the temperature distribution on the motherboard, making faulty components visible at a glance
• Intelligent troubleshooting automatically analyzes thermal imaging data to track motherboard failure points
• Adjustable lens, lens height can be adjusted up or down to make the focus clearer